JPH0438529Y2 - - Google Patents

Info

Publication number
JPH0438529Y2
JPH0438529Y2 JP1982178504U JP17850482U JPH0438529Y2 JP H0438529 Y2 JPH0438529 Y2 JP H0438529Y2 JP 1982178504 U JP1982178504 U JP 1982178504U JP 17850482 U JP17850482 U JP 17850482U JP H0438529 Y2 JPH0438529 Y2 JP H0438529Y2
Authority
JP
Japan
Prior art keywords
integrated circuit
amplifier
type
terminal
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982178504U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5983053U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17850482U priority Critical patent/JPS5983053U/ja
Publication of JPS5983053U publication Critical patent/JPS5983053U/ja
Application granted granted Critical
Publication of JPH0438529Y2 publication Critical patent/JPH0438529Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Amplifiers (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP17850482U 1982-11-26 1982-11-26 集積回路 Granted JPS5983053U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17850482U JPS5983053U (ja) 1982-11-26 1982-11-26 集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17850482U JPS5983053U (ja) 1982-11-26 1982-11-26 集積回路

Publications (2)

Publication Number Publication Date
JPS5983053U JPS5983053U (ja) 1984-06-05
JPH0438529Y2 true JPH0438529Y2 (en]) 1992-09-09

Family

ID=30387532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17850482U Granted JPS5983053U (ja) 1982-11-26 1982-11-26 集積回路

Country Status (1)

Country Link
JP (1) JPS5983053U (en])

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5649556A (en) * 1979-09-28 1981-05-06 Toshiba Corp Mos integrated circuit

Also Published As

Publication number Publication date
JPS5983053U (ja) 1984-06-05

Similar Documents

Publication Publication Date Title
JPS6331105B2 (en])
JPH08321599A (ja) Ｃｃｄ型電荷転移読出し用レジスタの電荷／電圧変換装置
JP2001231098A (ja) マイクロフォン装置
JPH0438529Y2 (en])
JP2000277621A (ja) 半導体装置
KR100364486B1 (ko) 반도체 장치
JPS604612B2 (ja) 差動増幅器
JPH0115219Y2 (en])
JP3061205B2 (ja) アクテイブフイルタ回路
JPS5851426B2 (ja) 半導体集積回路装置
JPH0526769Y2 (en])
JPS6269656A (ja) 半導体装置
JP2534140Y2 (ja) 集積回路
JP2690201B2 (ja) 半導体集積回路
JPH0312482B2 (en])
JPH0453103B2 (en])
JPS5915508Y2 (ja) 保護回路
JP2000252369A (ja) 半導体装置
JPH02260561A (ja) 半導体装置
JPS61172364A (ja) 定電圧回路を形成した半導体装置
JPS61150229A (ja) 集積回路
JPS6329847B2 (en])
JP2005045485A (ja) 光受信器
JPS60219803A (ja) 演算増幅器
JPH0369177B2 (en])